Wetting behaviour of copper on an iron aluminide alloy

Intermetallics

Volumn 12, Issue 3, 2004, Pages 289-294

  Brochu, M ^a   Pugh, M ^b   Drew, R A L ^a  

^a MCGILL UNIVERSITY   (Canada)

^b Dept of Electrical and Computer Engineering   (Canada)

Author keywords

A. Iron aluminides (based on Te3Al); B. Diffusion; C. Joining; C. Melting; F. Microscopy, various

Indexed keywords

ALLOYING; BRAZING; CONTACT ANGLE; COPPER; CORROSION RESISTANCE; DIFFUSION; ENERGY DISPERSIVE SPECTROSCOPY; GRAIN BOUNDARIES; JOINING; MELTING; OPTICAL MICROSCOPY; POINT DEFECTS; PRECIPITATION (CHEMICAL); SCANNING ELECTRON MICROSCOPY; SURFACE TENSION; WETTING;

ELECTRON MICRO PROBE ANALYSIS; IRON ALUMINIDE (BASED ON TE3AL); VARIOUS MICROSCOPY;

IRON ALLOYS;

EID: 0742324185     PISSN: 09669795     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.intermet.2003.10.007     Document Type: Article

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