Ultra-thinning processing of dielectric substrates by precision abrasive machining

CIRP Annals - Manufacturing Technology

Volumn 55, Issue 1, 2006, Pages 317-320

  Touge, M ^a   Watanabe, J ^a  

^a KUMAMOTO UNIVERSITY   (Japan)

Author keywords

Lapping; Polishing; Wafer

Indexed keywords

ABRASIVES; ATOMIC FORCE MICROSCOPY; LAPPING; MACHINING; POLISHING; POLYVINYL CHLORIDES;

DIAMOND WHEELS; ULTRA THINNING PROCESSING; WAFER;

DIELECTRIC MATERIALS;

EID: 33750048473     PISSN: 00078506     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0007-8506(07)60425-9     Document Type: Article

References (5)

1. Heisel, U., Avroutine, J., 2001, Process Analysis for the Evaluation of the Surface Formation and Removal Rate in Lapping, Annals of the CIRP, 50/1: 229-232.
2. Brinksmeier, E., Riemer, O., Gessenharter, A., Autschbach, L., 2004, Polishing of Structured Molds, Annals of the CIRP, 53/1: 247-250.
3. Namba, Y., Shiokawa, M., 1997, Surface Roughness Generation Mechanism of Ultraprecision Grinding of Optical Materials with a Cup-typed Resinoid-bonded Diamond Wheel, Annals of the CIRP, 46/1: 253-256.
4. Touge, M., Watanabe, J., 2004, Development of Ultra Thin Quartz by Abrasive, Key Engineering Materials, 257-258:123-128.
5. Touge, M., Matsuo, T., 1996, Removal Rate and Surface Roughness in High-Precision Lapping of Mn-Zn Ferrite, Annals of the CIRP, 45/1: 307-310.