Bonding structure and haemocompatibility of silicon-incorporated amorphous carbon

Thin Solid Films

Volumn 515, Issue 1, 2006, Pages 66-72

  Zhang, Sam ^a   Du, Hejun ^a   Ong, Soon Eng ^a   Aung, Kyaw Naing ^a   Too, Hui Chin ^a   Miao, Xigeng ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

Bonding structure; Haemocompatibility; Human platelet adhesion; Magnetron sputtering; Silicon incorporated unhydrogenated amorphous carbon (a C(Si)); Surface energy

Indexed keywords

BONDING STRUCTURE; HAEMOCOMPATIBILITY; HUMAN PLATELET ADHESION; SILICON-INCORPORATED UNHYDROGENATED AMORPHOUS CARBON (A-C(SI));

BIOCOMPATIBILITY; CARBON; INTERFACIAL ENERGY; MAGNETRON SPUTTERING; SILICON; STRESS RELAXATION;

AMORPHOUS MATERIALS;

EID: 33750031590     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2005.12.037     Document Type: Article

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