Development of packaging technologies for high-speed (>40 Gb/s) optical modules

IEEE Journal on Selected Topics in Quantum Electronics

Volumn 12, Issue 5, 2006, Pages 1017-1023

  Choi, Kwang Seong ^b   Kwon, Yong Hwan ^b   Choe, Joong Seon ^b   Chung, Yong Duck ^b   Kang, Young Shik ^b   Kim, Jeha ^a,b   Ahn, Byoung Tae ^b   Moon, Jong Tae ^b  

^a Electronics and Telecommunications Research Institute ^*

^b Electronics and Telecommunications Research Institute (ETRI)   (South Korea)

Author keywords

40 Gb s; Broadband performance; Inductive peaking; Packaging technologies; Traveling wave electro absorption modulator (TWEAM); Waveguide photodiode (WGPD)

Indexed keywords

BANDWIDTH; DIGITAL COMMUNICATION SYSTEMS; ELECTRONICS PACKAGING; LIGHT AMPLIFIERS; PHOTODIODES; WAVEGUIDES;

BROADBAND PERFORMANCE; INDUCTIVE PEAKING; PACKAGING TECHNOLOGIES; TRAVELING WAVE ELECTRO-ABSORPTION MODULATOR (TWEAM); WAVEGUIDE PHOTODIODE (WGPD);

OPTICAL COMMUNICATION;

EID: 33749845621     PISSN: 1077260X     EISSN: None     Source Type: Journal    
DOI: 10.1109/JSTQE.2006.882632     Document Type: Article

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