Preserving isolation in grounded coplanar waveguide circuits without via holes

IEEE Topical Meeting on Electrical Performance of Electronic Packaging

Volumn , Issue , 2000, Pages 265-268

  Hou, Bin ^a   Jackson, Robert W ^a  

^a UNIVERSITY OF MASSACHUSETTS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DIELECTRIC WAVEGUIDES; ELECTRIC GROUNDING; FLIP CHIP DEVICES; MATHEMATICAL MODELS; MILLIMETER WAVE DEVICES;

GROUNDED COPLANAR WAVEGUIDE (GCPW);

MONOLITHIC MICROWAVE INTEGRATED CIRCUITS;

EID: 0034497022     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (6)