The effects of copper CMP slurry chemistry on the colloidal behavior of alumina abrasives

Journal of the Electrochemical Society

Volumn 153, Issue 11, 2006, Pages

  Ihnfeldt, Robin ^a,b   Talbot, Jan B ^a,b  

^a UNIVERSITY OF CALIFORNIA SAN DIEGO   (United States)

^b ELECTROCHEMICAL SOCIETY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINA ABRASIVES; CHEMICAL MECHANICAL PLANARIZATION (CMP); SLURRY CHEMISTRY; ZETA POTENTIAL;

ABRASIVES; ALUMINA; CHEMICAL MECHANICAL POLISHING; COLLOIDS; COPPER; PH EFFECTS; SUSPENSIONS (COMPONENTS);

SLURRIES;

EID: 33749646845     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.2335982     Document Type: Article

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