Thermoelectric properties of texture-controlled Bi1.9Sb 0.1Te2.7Se0.3 compounds prepared by angular extrusion technique

Materials Transactions

Volumn 47, Issue 8, 2006, Pages 1941-1944

  Hayashi, Takahiro ^a   Sekine, Masayoshi ^a   Suzuki, Junya ^a   Horio, Yuma ^a  

^a YAMAHA CORPORATION   (Japan)

Author keywords

Angular extrusion; Bismuth telluride; Rapid solidification; Texture; Thermoelectric properties

Indexed keywords

ANGULAR EXTRUSION; BISMUTH-TELLURIDE; ORIENTATION IMAGING MICROSCOPY (DIM);

BISMUTH ALLOYS; CARRIER CONCENTRATION; CARRIER MOBILITY; ELECTRIC CONDUCTIVITY; GRAIN SIZE AND SHAPE; RAPID SOLIDIFICATION; THERMOELECTRICITY;

BISMUTH COMPOUNDS;

EID: 33749556756     PISSN: 13459678     EISSN: None     Source Type: Journal    
DOI: 10.2320/matertrans.47.1941     Document Type: Article

References (12)

1. J. R. Wiese and L. Muldawer: J. Phys. Chem. Solids 15 (1960) 13-16.
2. J. Seo, C. Lee and K. Park: Mater. Sci. Eng. B 49 (1998) 135-140.
3. S. Miura, Y. Sato, K. Fukuda, K. Nishimura and K. Ikeda: Mater. Sci. Eng. A 277 (2000) 244-249.
4. T. Kajihara, K. Fukuda, Y. Sato and M. Kikuchi: Proc. 17th International Conference on Thermoelectrics: Nagoya. Japan. (1998) 129-133.
5. E. J. Gonzalez, J. E. Blendell, J. P. Cline and J. J. Ritter: J. Mater. Res. 13 (1998) 766-773.
6. T. G. Langdon, M. Furukawa, Z. Horita and M. Nemoto: JOM 50 (1998) 41-45.
7. V. M. Segal: Mater. Sci. Eng. A 197 (1995) 157-164.
8. J.-T. Im, K. T. Hartwig and J. Sharp: Acta Materialia 52 (2004) 49-55.
9. S. S. Kim, S. Yamamoto and T. Aizawa: J. Alloys Compd. 375 (2004) 107-113.
10. T. Hayashi, M. Sekine, J. Suzuki and Y. Horio: Mater. Sci. Forum 503-504 (2006) 567-572.
11. Y. Horio, H. Yamashita and T. Hayashi: Mater. Trans. 11 (2005) 2525-2529.
12. K.-H. Kim and S. Katayama: Applied Physics (Japan) 39 (1970) 1028-1033.