2D compound formation during copper dissolution: An electrochemical STM study

Surface Science

Volumn 600, Issue 18, 2006, Pages 3971-3977

  Broekmann, P ^a   Hai, N T M ^a   Wandelt, K ^a  

^a UNIVERSITY OF BONN   (Germany)

Author keywords

Anion effects; Corrosion; Electrified interfaces; STM

Indexed keywords

COPPER; CYCLIC VOLTAMMETRY; DISSOLUTION; ELECTROLYTES; SCANNING TUNNELING MICROSCOPY;

ANION EFFECTS; ELECTRIFIED INTERFACES; KINK SITES; STRUCTURAL MOTIFS;

THIN FILMS;

EID: 33749138411     PISSN: 00396028     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.susc.2006.01.109     Document Type: Article

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