Indentation fracture of a-C:H thin films from chemical vapour deposition

Philosophical Magazine

Volumn 86, Issue 33-35 SPEC. ISSUE, 2006, Pages 5397-5406

  Lepienski, C M ^a   Michel, M D ^b   Araujo P J G ^c   Achete, C A ^c  

^a FEDERAL UNIVERSITY OF PARANÁ   (Brazil)

^b Brazil   (Brazil)

^c FEDERAL UNIVERSITY OF RIO DE JANEIRO   (Brazil)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL VAPOR DEPOSITION; CRACK INITIATION; ELASTIC MODULI; ELECTRIC POTENTIAL; HARDNESS; INDENTATION; RESIDUAL STRESSES;

BERKOVICH INDENTERS; CHIPPING; FILM THICKNESSES;

THIN FILMS;

EID: 33748760887     PISSN: 14786435     EISSN: 14786443     Source Type: Journal    
DOI: 10.1080/14786430600732085     Document Type: Conference Paper

References (12)

1. A.M. Lettington, Carbon 36 555 (1998).
2. B. Bhushan, Diamond Relat. Mater. 8 1985 (1999).
3. J. Robertson, Mater. Sci. Eng. R 37 129 (2002).
4. X. Li, D. Diao and B. Bhushan, Acta Mater. 45 4453 (1997).
5. A.A. Volinski, N.R. Moody and W.W. Gerberich, Acta Mater. 50 441 (2002).
6. G.R. Antis, P. Chantikul, B.R. Lawn, et al., J. Am. Ceram. Soc. 64 533 (1981).
7. J. Malzbender, J.M.J. den Toonder, A.R. Balkenende, et al., Mater. Sci. Eng. R 36 47 (2002).
8. J.M.J. den Toonder, J. Malzbender, G. de With, et al., J. Mater. Res. 17 224 (2002).
9. M.D. Michel, L.V. Muhlen, C.A. Achete, et al., Thin Solid Films 496 481 (2006).
10. W.C. Oliver and G.M. Pharr, J. Mater. Res. 7 1564 (1992).
11. R. Rabe, J.M. Breguet, P. Schwaller, et al., Thin Solid Films 469 206 (2004).
12. J.E. Bradly, J.S. Williams, J. Wong-Leung, et al., J. Mater. Res. 16 1500 (2001).