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Volumn 2006, Issue , 2006, Pages 390-395

Optimal topology exploration for application-specific 3D architectures

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER ARCHITECTURE; DATA PROCESSING; LINEAR PROGRAMMING; MICROPROCESSOR CHIPS; PROGRAM PROCESSORS;

EID: 33748598426     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1145/1118299.1118396     Document Type: Conference Paper
Times cited : (13)

References (23)
  • 6
    • 33645351658 scopus 로고    scopus 로고
    • 3D processing technology and its impact on IA32 microprocessors
    • B. Black, et al, 3D Processing technology and Its Impact on IA32 Microprocessors, In Proc. of ICCD, 2004.
    • (2004) Proc. of ICCD
    • Black, B.1
  • 10
    • 2942658001 scopus 로고    scopus 로고
    • Timing, energy, and thermal performance of three-dimensional integrated circuits
    • S. Das, Timing, energy, and Thermal performance of Three-Dimensional Integrated Circuits, In Proc. of GLSVLSI, 2004.
    • (2004) Proc. of GLSVLSI
    • Das, S.1
  • 11
    • 33745949868 scopus 로고    scopus 로고
    • Technology, performance, and computer-aided design of three-dimensional integrated circuits
    • S. Das, et al, Technology, Performance, and computer-aided Design of Three-Dimensional integrated Circuits, In Proc. of ISPD, 2004.
    • (2004) Proc. of ISPD
    • Das, S.1
  • 12
    • 2442452519 scopus 로고    scopus 로고
    • 2.5D system integration: A design driven system implementation schema
    • Y. Deng, et al, 2.5D System Integration: A Design Driven System Implementation Schema, In Proc. of ASP-DAC, 2004.
    • (2004) Proc. of ASP-DAC
    • Deng, Y.1
  • 14
    • 0034452632 scopus 로고    scopus 로고
    • Full chip thermal analysis of planar (2D) and vertically integrated (3D) high performance ICs
    • S. Im and K. Banerjee, Full Chip Thermal Analysis of Planar (2D) and Vertically Integrated (3D) High Performance ICs, Tech. Digest IEDM 2000, pp.727-730.
    • Tech. Digest IEDM 2000 , pp. 727-730
    • Im, S.1    Banerjee, K.2
  • 19
    • 0042090418 scopus 로고    scopus 로고
    • Xtream-fit: An energy-delay efficient data memory subsystem for embedded media processing
    • Anaheim, CA, June
    • A. Ramachandran and M. F. Jacome, Xtream-Fit: An Energy-Delay Efficient Data Memory Subsystem for Embedded Media Processing, In Proc. of the 40th Design Automation Conference, Anaheim, CA, June 2003.
    • (2003) Proc. of the 40th Design Automation Conference
    • Ramachandran, A.1    Jacome, M.F.2
  • 23
    • 27644507835 scopus 로고    scopus 로고
    • Xpress-MP, http://www.dashoptimization.com/pdf/Mosell.pdf, 2002.
    • (2002) Xpress-MP


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.