Protection of self-assembled monolayers formed from triethyl phosphate and mixed self-assembled monolayers from triethyl phosphate and cetyltrimethyl ammonium bromide for copper against corrosion

Electrochimica Acta

Volumn 52, Issue 1, 2006, Pages 108-113

  Guo, W J ^a   Chen, S H ^a,b   Huang, B D ^a   Ma, H Y ^a   Yang, X G ^a  

^a SHANDONG UNIVERSITY   (China)

^b INSTITUTE OF METAL RESEARCH   (China)

Author keywords

Copper; Electrochemical impedance spectroscopy (EIS); Mixed films; Self assembled monolayers (SAMs); Triethyl phosphate (TEP)

Indexed keywords

AMMONIUM COMPOUNDS; COPPER; COPPER CORROSION; CORROSION PROTECTION; PHOSPHATES; SPECTROSCOPY;

AB INITIO CALCULATIONS; CORROSION INHIBITION; INHIBITION EFFICIENCY (IE); TRIETHYL PHOSPHATE (TEP);

SELF ASSEMBLY;

EID: 33748538303     PISSN: 00134686     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.electacta.2006.03.089     Document Type: Article

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