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Volumn , Issue , 1996, Pages 86-88

Flexible access to MCM technology via the multichip module designers' access service (MIDAS)

Author keywords

[No Author keywords available]

Indexed keywords

COSTS; ELECTRONICS PACKAGING; FOUNDRIES; INTEGRATED CIRCUIT LAYOUT; MANUFACTURE; SOCIETIES AND INSTITUTIONS; SUBSTRATES; TECHNOLOGY;

EID: 0029771319     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (4)

References (0)
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.