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Volumn , Issue , 1996, Pages 86-88
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Flexible access to MCM technology via the multichip module designers' access service (MIDAS)
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Author keywords
[No Author keywords available]
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Indexed keywords
COSTS;
ELECTRONICS PACKAGING;
FOUNDRIES;
INTEGRATED CIRCUIT LAYOUT;
MANUFACTURE;
SOCIETIES AND INSTITUTIONS;
SUBSTRATES;
TECHNOLOGY;
MIXED SIGNAL MULTICHIP MODULE TECHNIQUE;
MULTICHIP MODULE DESIGNERS ACCESS SERVICE;
TOOLING;
MULTICHIP MODULES;
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EID: 0029771319
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
Times cited : (4)
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References (0)
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