Reliability statistics perspective on Standard Wafer-level Electromigration Accelerated Test (SWEAT)

Canadian Conference on Electrical and Computer Engineering

Volumn 1, Issue , 2000, Pages 167-172

  Tan, Cher Ming ^a   Yeo, Kelvin Ngan Chong ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

HIGH TEMPERATURE GRADIENTS; RELIABILITY STATISTICS; STANDARD WAFER LEVEL ELECTROMIGRATION ACCELERATED TEST;

CURRENT DENSITY; FEEDBACK CONTROL; HEAT RESISTANCE; HIGH TEMPERATURE EFFECTS; INTEGRATED CIRCUIT TESTING; METALLIZING; RELIABILITY; STATISTICAL METHODS; THERMAL GRADIENTS;

ELECTROMIGRATION;

EID: 0033686705     PISSN: 08407789     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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