Preparation, characterization and dielectric properties of 4,4-diphenylmethane diisocyanate (MDI) based cross-linked polyimide films

European Polymer Journal

Volumn 42, Issue 6, 2006, Pages 1370-1377

  Deligöz, Hüseyin ^a   Yalcinyuva, Tuncer ^a   Özgümüs, Saadet ^a   Yildirim, Saffettin ^a  

^a ISTANBUL UNIVERSITY   (Turkey)

Author keywords

Cross linking; Dielectric properties; Polyimide; Thin film

Indexed keywords

ADHESION; CARBOXYLIC ACIDS; CHEMICAL REACTIONS; CROSSLINKING; CURRENT VOLTAGE CHARACTERISTICS; DIELECTRIC PROPERTIES; FOURIER TRANSFORM INFRARED SPECTROSCOPY; HARDNESS; ORGANIC COMPOUNDS; PERMITTIVITY; SCANNING ELECTRON MICROSCOPY; THIN FILMS; WATER;

4,4-DIPHENYLMETHANE DIISOCYANATE (MDI); CROSS-LINKED POLYIMIDE (CPI); DIELECTRIC BREAKDOWN VOLTAGE; LEAKAGE DENSITY; WATER UPTAKE;

POLYIMIDES;

EID: 33748045471     PISSN: 00143057     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.eurpolymj.2005.12.005     Document Type: Article

References (29)

1. Abadie M.J.M., and Sillion B. Polyimides and other high temperature polymers (1991), Elsevier, Amsterdam
2. Ghosh M.K., and Mittal K.L. Polyimides, fundamentals and applications (1996), Mercel-Dekker. Inc, New York
3. Gao C.P., Paventi M., and Hay A.S. J Polym Sci Part A: Polym Chem 34 (1996) 413-420
4. Shao L., Chung T.-S., Goh S.-H., and Pramoda K.P. J Membr Sci 256 (2005) 46-56
5. Ayala D., Lozano A.E., Abajo J.D., Garcia Perez C., Dela Campa J.G., and Peinemann K.V. J Membr Sci 215 (2003) 61
6. Chang T.S., and Kafchinski R.E. J Membr Sci 75 (1992) 181
7. Shao L., Chung T.-S., and Goh S.-H. J Membr Sci 238 (2004) 153-165
8. Staudt-Buckel C. Soft Mater 1 (2003) 277-293
9. Tin P.S., Chung T.S., Liu Y., Wang R., Liu S.L., and Promada K.P. J Membr Sci 225 (2003) 77-90
10. Sullivan D.M., and Bruening M.L. J Membr Sci 248 (2005) 161-170
11. Maier G. Prog Polym Sci 26 (2001) 3-65
12. Dunson DL. PhD thesis, Virginia Polytechnic University, Virginia, USA, 2000.
13. Bersama J.N., Klijustra S.D., Balster J.H., Van der vegt N.F.A., Koops G.H., and Wesseling M. J Membr Sci 238 (2004) 93
14. Wind J.D., Staudt-Bickel C., Paul D.R., and Koros W.J. Macromolecules 36 (2003) 1882
15. Liu Y., Wang R., and Chung T.-S. J Membr Sci 189 (2001) 231-239
16. Fay C.C., and St. Clair A.K. J Appl Polym Sci 69 (1998) 2383-2393
17. Chern Y.T. Macromolecules 31 (1998) 5837-5844
18. Chern Y.T., and Shiue H.-C. Macromolecules 30 (1997) 4646-4651
19. Park S.-J., Cho K.-S., and Kim S.-H. J Colloid Interface Sci 272 (2004) 384
20. Yamazaki O., Yamashita T., and Horie K. React Funct Polym 43 (2000) 173-181
21. Xu K., and Economy J. Macromolecules 37 11 (2004) 4146-4155
22. Eiju I, Hideyuki I, Masatoshi M. JP2004285084, 2004.
23. He J., Yamashita T., and Horie K. Macromol Chem Phys 199 (1998) 949-954
24. Microyannidis J.A. J Appl Polym Sci 53 (1994) 1357-1363
25. Deligöz H., Yalçi{dotless}nyuva T., Özgümüş S., Yi{dotless}ldi{dotless}ri{dotless}m S., Deger D., and Ulutaş K. Polymer 46 (2005) 3720-3729
26. Muruganand S., Naryandass Sa.K., Mangalaraj D., and Vijayan T.M. Polym Int 50 (2001) 1089-1094
27. Feger C., and Franke H. Polyimides in high performance electronics packaging and optoelectronic applications. In: Feger Ghosh M.K., and Franke Mittal K.L. (Eds). Polyimides: fundamentals and applications (1996), Marcel Dekker, Inc, New York
28. In: Tummala R.R., Rymaszewski E.J., and Klopfenstein A.G. (Eds). Microelectronics packaging handbook: semiconductor packaging, Pt. II. 2nd ed. (1997), Chapman & Hall, Inc.
29. Magaraphan R., Lilayuthalert W., Sirivat A., and Schwank J.W. Compos Sci Technol 61 (2001) 1253