EUV mask development status at ASET and DNP

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 6283 I, Issue , 2006, Pages

  Abe, Tsukasa ^a   Fujii, Akiko ^a   Mohri, Hiroshi ^a   Hayashi, Naoya ^a   Tanaka, Yuusuke ^b   Nishiyama, Iwao ^b  

^a DAI NIPPON PRINTING CO LTD   (Japan)

^b ASSOCIATION OF SUPER ADVANCED ELECTRONICS TECHNOLOGIES ASET   (Japan)

Author keywords

Absorber layer; AFM nano machining; Buffer layer; EUV; Mask; Repair

Indexed keywords

ATOMIC FORCE MICROSCOPY; CHROMIUM; DRY ETCHING; SCANNING ELECTRON MICROSCOPY; SILICON WAFERS; TANTALUM COMPOUNDS;

ABSORBER LAYER; AFM NANO-MACHINING; BUFFER LAYER; EUV REFLECTIVITY;

MASKS;

EID: 33748038040     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.681840     Document Type: Conference Paper

References (2)

1. Y. Tanaka, D. Kim, H. Yamanashi and I. Nishiyama, Proc. SPIE 5374, 281 (2004).
2. T. Shoki, M. Hosoya, T. Kinoshita, H. Kobayashi, Y. Usui, R. Ohkubo, S Ishibashi and O. Nakarekawa, Proc. SPIE 4754, 857 (2002)