Intermetallic compound formation and solderability for immersion tin

Circuit World

Volumn 32, Issue 4, 2006, Pages 3-8

  Chan, C M ^a   Tong, K H ^a   Kwok, R W M ^a  

^a ROHM AND HAAS COMPANY   (United States)

Author keywords

Circuit boards; Soldering; Solders

Indexed keywords

AUGER ELECTRON SPECTROSCOPY; DEGRADATION; PRINTED CIRCUIT BOARDS; SOLDERING; SOLDERING ALLOYS; TIN; X RAY PHOTOELECTRON SPECTROSCOPY;

IMMERSION TIN DEPOSIT; MULTIPLE LEAD-FREE REFLOW CYCLES; REFLOW CYCLES;

INTERMETALLICS;

EID: 33747822054     PISSN: 03056120     EISSN: None     Source Type: Journal    
DOI: 10.1108/03056120610683540     Document Type: Article

References (7)

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5. Shih, R.L.H., Lau, D.Y.K., Kwok, R.W.M., Li, M. and Sun, M.K.W. (2004), “Reliability of interfaces for lead-free solder bumps”, paper presented at the 5th International Conference on Thermal & Mechanical Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSim 2004, Brussels, pp. 615-9.
6. Tu, K.N., Gusak, A.M. and Li, M. (2003), “Physics and materials challenges for lead-free solders”, Journal of Applied Physics, Vol. 93 No. 3, pp. 1335-53.
7. Zheng, Y., Hillman, C. and McCluskey, P. (2002), “Intermetallic growth on PWBs soldered with Sn3.8Ag0.7Cu”, Proceedings of the 52nd Electronic Components and Technology Conference, San Diego, pp. 1226-31.