Short and long-term stability problems of Hall plates in plastic packages

Annual Proceedings - Reliability Physics (Symposium)

Volumn , Issue , 2000, Pages 225-230

  Manic, D ^a   Petr, J ^b   Popovic, R S ^a  

^a EPFL   (Switzerland)

^b Siemens Schweiz AG   (Switzerland)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; ENCAPSULATION; FAILURE ANALYSIS; HALL EFFECT; PIEZOELECTRICITY; PLASTIC PRODUCTS; SOLDERING; STRESS ANALYSIS; THERMAL CYCLING; THERMAL STRESS; VISCOELASTICITY; VISCOUS FLOW;

HALL PLATES;

INTEGRATED CIRCUIT TESTING;

EID: 0033741472     PISSN: 00999512     EISSN: None     Source Type: Journal    
DOI: 10.1109/RELPHY.2000.843919     Document Type: Article

References (11)

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