Analysis of the production of ATLAS indium bonded pixel modules

Nuclear Instruments and Methods in Physics Research, Section A: Accelerators, Spectrometers, Detectors and Associated Equipment

Volumn 565, Issue 1, 2006, Pages 296-302

  Alimonti, G ^a   Andreazza, A ^a   Bulgheroni, A ^a   Corda, G ^b   Di Gioia, S ^b   Fiorello, A ^b   Gemme, C ^c   Koziel, M ^a   Manca, F ^a   Meroni, C ^a   Nechaeva, P ^c   Paoloni, A ^b   Rossi, L ^c   Rovani, A ^c   Ruscino, E ^c  

^a UNIVERSITY OF MILAN   (Italy)

^b SELEX SISTEMI INTEGRATI   (Italy)

^c UNIVERSITY OF GENOA   (Italy)

Author keywords

Indium bump; Pixel detector; Stripping

Indexed keywords

DEPOSITION; MICROPROCESSOR CHIPS; PROBLEM SOLVING; STRIPPING (REMOVAL);

CHIP STRIPPING MACHINE; INDIUM BUMP; PIXEL DETECTORS; STRIPPING;

FLIP CHIP DEVICES;

EID: 33747198430     PISSN: 01689002     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.nima.2006.05.048     Document Type: Article

References (5)

1. Atlas Pixel Detector TDR, LHCC 98/13, CERN 1998.
2. Gemme C. Nucl. Instr. and Meth. A 465 (2001) 200
3. Caccia M. Nucl. Instr. and Meth. A 465 (2001) 195
4. Airoldi A., et al. Nucl. Instr. and Meth. A 540 (2005) 259
5. Blanquart L., et al. IEEE Trans. Nucl. Sci. NS-51 N4 (2004) 1358