A chip removal facility for indium bump bonded pixel detectors

Nuclear Instruments and Methods in Physics Research, Section A: Accelerators, Spectrometers, Detectors and Associated Equipment

Volumn 540, Issue 2-3, 2005, Pages 259-265

  Airoldi, A ^a   Alimonti, G ^b   Amati, M ^a   Andreazza, A ^b   Bulgheroni, A ^a   Caccia, M ^a   Giugni, D ^b   Kucewicz, W ^c   Lari, T ^b   Meroni, C ^b   Ragusa, F ^b   Troncon, C ^b   Vegni, G ^b  

^a UNIVERSITY OF INSUBRIA   (Italy)

^b INFN SEZIONE DI MILANO   (Italy)

^c AGH UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Poland)

Author keywords

Indium bump; Pixel detector; Stripping

Indexed keywords

DYNAMOMETERS; FLIP CHIP DEVICES; HIGH ENERGY PHYSICS; INDIUM; MICROELECTROMECHANICAL DEVICES; PHOTORESISTORS; X RAYS;

CONTACT DENSITY; INDIUM BUMP; PIXEL DETECTORS; STRIPPING;

SENSORS;

EID: 20244368665     PISSN: 01689002     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.nima.2004.11.042     Document Type: Article

References (10)

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