A modeling approach to describe the adhesion of rough, asymmetric particles to surfaces

Journal of Colloid and Interface Science

Volumn 299, Issue 2, 2006, Pages 656-664

  Eichenlaub, Sean ^a   Kumar, Gautam ^b   Beaudoin, Stephen ^b  

^a Arizona State University   (United States)

^b PURDUE UNIVERSITY   (United States)

Author keywords

Atomic force microscopy; Electrostatics; Particle adhesion; Post CMP cleaning; Roughness; van der Waals forces

Indexed keywords

ADHESION; ALUMINA; ATOMIC FORCE MICROSCOPY; ELECTROSTATICS; POLYSTYRENES; SILICA; SURFACE ROUGHNESS; VAN DER WAALS FORCES;

ASPERITY DEFORMATION; ELECTROSTATIC INTERACTION; PARTICLE ADHESION; POST CMP CLEANING;

SURFACE CHEMISTRY;

ALUMINUM OXIDE; LATEX; POLYSTYRENE; SILICON DIOXIDE;

ADHESION; AQUEOUS SOLUTION; ARTICLE; ATOMIC FORCE MICROSCOPY; ELECTRICITY; FORCE; GEOMETRY; MEASUREMENT; PREDICTION; PRIORITY JOURNAL; QUANTITATIVE ANALYSIS; SURFACE PROPERTY; THEORETICAL MODEL; THEORETICAL STUDY;

EID: 33747076114     PISSN: 00219797     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jcis.2006.03.010     Document Type: Article

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