Characteristics of piezoelectric multilayer devices containing metal-oxide multicomponent electrode

Ferroelectrics

Volumn 338, Issue , 2006, Pages 9-16

  Jeong, S J ^a   Song, J S ^a   Min, B K ^a   Lee, W J ^a   Park, E C ^a  

^a Korea Electrotechnology Research Institute (KERI)   (South Korea)

Author keywords

Adhesion; Ag oxide electrode; Piezoelectric multilayer devices; Shrinkage

Indexed keywords

ACTUATORS; DENSIFICATION; ELECTRODES; PIEZOELECTRIC DEVICES; SCANNING ELECTRON MICROSCOPY; SINTERING; TITANIUM ORE TREATMENT;

AG-OXIDE ELECTRODE; CERAMIC MATRIX; MECHANICAL BONDING; PIEZOELECTRIC MULTILAYER DEVICES;

MULTILAYERS;

EID: 33746861558     PISSN: 00150193     EISSN: 15635112     Source Type: Conference Proceeding    
DOI: 10.1080/00150190600732496     Document Type: Conference Paper

References (10)

1. W. Wersing, H. Wahl, andM. Schnoller, PZT-Based MultilayerPiezoelectric Ceramics with AgPd-Internal Electrodes. Ferroelectrics 87, 271-294 (1988).
2. C. R. Chang and J. H. Jean, Effects of Silver-Paste Formulation on Camber Development during the Cofiring of a Silver-Based Low-Temperature-Cofired Ceramic Package. J. Am. Ceram. Soc. 81, 2805-2814 (1998).
3. S. F. Wang and J. P. Dougherty, Silver-Palladium Thick-Film Conductors. J. Am. Ceram. Soc. 77, 3051-3072 (1994).
4. J. H. Jean and C. R. Chany, Effect of Densification Mismatch on Camber Development during Cofiring of Nickel-Based Multilayer Ceramic Capacitors. J. Am. Ceram. Soc. 80, 2401-2406 (1997).
5. J. Pepin and W. Borland Electrode-Based Causes of Delaminations in Multilayer Ceramic Capacitors. J. Am. Ceram. Soc. 72, 2287-2291 (1989).
6. J. H. Jean and C. R. Chany, Camber development during cofiring Ag-based low-dielectric-constant ceramic package. J. Mater. Res. 12, 2743-2750 (1997).
7. T. Cheng and P. Raj, Flaw Generation During Constrained Sintering of Metal-Ceramic and MetalGlass Multilayer Films. J. Am. Ceram. Soc. 72, 1649-1655 (1989).
8. R. Ueyama, K. Kamada, M. Harada, T. Ueyama, T. Yamamoto, K. Kuribayashi, K. Koumoto, and T. Shiosaki, Low temperature synthesis of silver-palladium alloy powders internal electrodes for multilayer ceramic devices. J. Mater. Sci. 36, 371-379 (2001).
9. S. J. Lee and W. M. Kriven, Bonding behavior of Cu/Cuo thick film on a low-firing ceramic substrate. J. Mater. Res. 12, 2411-2418 (1997).
10. R. Zuo, L. L. Z. Gui, X. Hu, and C. Ji, Effects of Additives on the Interfacial Microstructure of Cofired Electrode-Ceramic Multilayer Systems. J. Am. Ceram. Soc. 85, 787-793 (2002).