Bonding behavior of Cu/CuO thick film on a low-firing ceramic substrate

Journal of Materials Research

Volumn 12, Issue 9, 1997, Pages 2411-2418

  Lee, Sang Jin ^a   Kriven, Waltraud M ^a   Park, Jeong Hyun ^b   Yoon, Young Soo ^c  

^a UNIVERSITY OF ILLINOIS AT URBANA CHAMPAIGN   (United States)

^b Yonsei University   (South Korea)

^c UNIVERSITY OF MINNESOTA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; ALUMINA; BOND STRENGTH (MATERIALS); BONDING; BOROSILICATE GLASS; COPPER OXIDES; DIFFUSION IN SOLIDS; FIRING (OF MATERIALS); INTERFACES (MATERIALS); SUBSTRATES; THICK FILMS;

GLASS FRIT; SOFTENING POINT;

CERAMIC MATRIX COMPOSITES;

EID: 0031233355     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/JMR.1997.0319     Document Type: Article

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