Photoimageable silver paste for high density interconnection technology

Materials Letters

Volumn 59, Issue 4, 2005, Pages 503-509

  Umarji, G G ^a   Ketkar, S A ^a   Phatak, G J ^a   Seth, T ^a   Mulik, U P ^a   Amalnerkar, D P ^a  

^a CENTRE FOR MATERIALS FOR ELECTRONICS TECHNOLOGY C MET   (India)

Author keywords

Conductor paste; Electronic materials; Photoimaging; Thick films

Indexed keywords

ELECTRIC CONDUCTIVITY; EPOXY RESINS; IMAGING SYSTEMS; MICROCONTROLLERS; PHOTORESISTS; POLYMERS; SIGNAL PROCESSING; SILVER; THICK FILMS;

CONDUCTOR PASTES; ELECTRONIC MATERIALS; INORGANIC PHASES; PHOTOIMAGING; SILVER PASTES;

ELECTRONICS ENGINEERING;

EID: 9944233478     PISSN: 0167577X     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.matlet.2004.10.034     Document Type: Article

References (7)

1. John H. Lau, S.W. Ricky Lee, Microvias, vol. 5, McGraw Hill, 2001, p. 163.
2. Glicksman, Howard David, Yang, Haixin, Patent U.S.A. Application, 20030138708, 24th July, 2001.
3. Toshiro Takeda, Motoji Saegusa, Japanese Patent, JP 2001188342, 10th July, 2001.
4. Govind G. Umarji, Supriya A. Ketkar, R. Marimuthu, G.J. Phatak, T. Seth, D.P. Amalnerkar, U.P. Mulik, Proc. 15th National Symp. on Smart and Light Mat., AGM MRSI, Banaras, India, 2004, p. 64.
5. S.B. Rane, M.S. Ghatpande, T. Seth, G.J. Phatak, D.P. Amalnerkar, Trans. SAEST 37 (2002) 95.
6. Stefen Muckett, Dr. Jurate Minalgene, Private communication, 2004.
7. Michael A. Skurski, Michael A. Smith, Richard R. Draudt, Daniel I. Amey, Samuel J. Horowitz, Michael J. Champ, Int. J. Microcircuits Electron. Packag. 21 (4) (1998) 355.