Impact of line edge roughness on copper interconnects

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 24, Issue 4, 2006, Pages 1859-1862

  Leunissen, L H A ^a   Zhang, W ^a,b   Wu, W ^c   Brongersma, S H ^a  

^a IMEC   (Belgium)

^b UNIVERSITY OF LEUVEN   (Belgium)

^c NOVELLUS SYSTEMS INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER INTERCONNECTS; E-BEAM LITHOGRAPHY; FRONT-END TECHNOLOGY; LINE EDGE ROUGHNESS (LER);

ELECTRIC CURRENTS; ELECTRIC RESISTANCE; ELECTRON BEAMS; GATES (TRANSISTOR); LITHOGRAPHY; SPATIAL VARIABLES MEASUREMENT; SURFACE ROUGHNESS;

ELECTRIC CONNECTORS;

EID: 33746566024     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.2217974     Document Type: Article

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