Industrial Scale Manufacturing Process for Embedding Active Components Inside Organic Substrate

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 5288, Issue , 2003, Pages 247-250

  Palm, Petteri ^a   Tuominen, Risto ^a  

^a Imbera Electronics Oy   (Finland)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; FLIP CHIP DEVICES; INTEGRATED CIRCUITS; INTERCONNECTION NETWORKS; PACKAGING; PRINTED CIRCUIT BOARDS; SOLDERING;

HIGH DENSITY (HDI); PACKAGING DENSITY; PORTABLE ELECTRONICS; SURFACE MOUNT TECHNOLOGY (SMT);

MICROELECTRONICS;

EID: 2342484515     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

1. J. Ranta, "Electronics Miniaturisation - In International Context", ELMO-Miniaturising Electronics start-up seminar, Helsinki, Finland, 23.1.2002
2. R. Tuominen, P. Palm, "Development of industrial scale manufacturing line for Integrated Module Board technology", The Sixth VSLI Packaging Workshop of Japan Technical Digest, Kyoto 12 - 14 November, 2002 pp. 13-17
3. C. M. Scanlan, N. Karim, "Systen-In-Package Technology, Applications and Trends", Http://www.amkor.com/products/notes_papers/ SiP_TECHNOLOGY_APPLICATION_AND_T RENDS_Paper.PDF
4. th ECTC, 1999, pp. 155-159.
5. th International Conference on Adhesive Joining & Coating Technology in Electronics Manufacturing, 18-21 June, 2000, Helsinki, pp. 269-273.
6. st International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Potsdam, 2001, pp. 218-223