Electroless gold plating from ammonium citrate baths by displacement reaction

Electrochemistry

Volumn 73, Issue 6, 2005, Pages 435-439

  Kurashina, Tadashi ^a   Nozawa, Yumi ^a   Kaneko, Norio ^b   Shinohara, Naoyuki ^b   Nawafune, Hidemi ^c  

^a Yamato Denki IndCoLtd   (Japan)

^b SHINSHU UNIVERSITY   (Japan)

^c KONAN UNIVERSITY   (Japan)

Author keywords

Electoless Au Plating; Polyethylene Glycol; Sodium Dodecyl Sulfate

Indexed keywords

CORROSION; ELECTROCHEMISTRY; ELECTROLESS PLATING; GOLD PLATING; NICKEL; OXIDATION; POLYETHYLENE GLYCOLS; SCANNING ELECTRON MICROSCOPY;

DISPLACEMENT REACTIONS; ELECTROLESS AU PLATING; SODIUM DODECYL SULFATE; WIRE PULL STRENGTH;

AMMONIUM COMPOUNDS;

EID: 22544445257     PISSN: 13443542     EISSN: None     Source Type: Journal    
DOI: 10.5796/electrochemistry.73.435     Document Type: Article

References (21)

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2. C. D. Lacovangelo and K. P. Zarnoch, J. Electrochem. Soc.,138, 983 (1991).