Gold wire bondability of electroless gold plating using disulfiteaurate complex

Journal of Applied Electrochemistry

Volumn 28, Issue 5, 1998, Pages 525-529

  Watanabe, H ^a   Abe, S ^a   Honma, H ^a  

^a KANTO GAKUIN UNIVERSITY   (Japan)

Author keywords

Activating treatment; Disulfiteaurate complex; Electroless gold plating; Electroless nickel plating; Noncyanide bath; Wire bondability

Indexed keywords

BOND STRENGTH (MATERIALS); COMPOSITION EFFECTS; ELECTROLESS PLATING; NICKEL PLATING; NITROGEN COMPOUNDS; PHOSPHORUS; STABILIZERS (AGENTS); SULFUR COMPOUNDS;

DISULFITEAURATE COMPLEX; WIRE BONDABILITY;

GOLD PLATING;

EID: 0032071860     PISSN: 0021891X     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1003273329474     Document Type: Article

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