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Volumn 2005, Issue , 2005, Pages 317-321

Buffer insertion under process variations for delay minimization

Author keywords

[No Author keywords available]

Indexed keywords

BUFFER INSERTION TECHNIQUES; DELAY MINIMIZATION; RANDOM VARIABLES;

EID: 33745967511     PISSN: 10923152     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICCAD.2005.1560086     Document Type: Conference Paper
Times cited : (16)

References (13)
  • 2
    • 0041633858 scopus 로고    scopus 로고
    • Parameter variations and impact on circuits and microarchitecture
    • ACM Press
    • Shekhar Borkar, Tanay Karnik, Siva Narendra, Jim Tschanz, Ali Keshavarzi, and Vivek De. Parameter variations and impact on circuits and microarchitecture. In DAC 2009, pages 338-342. ACM Press, 2003.
    • (2003) DAC 2009 , pp. 338-342
    • Borkar, S.1    Karnik, T.2    Narendra, S.3    Tschanz, J.4    Keshavarzi, A.5    De, V.6
  • 3
    • 0025594311 scopus 로고
    • Buffer placement in distributed re-tree network for minimal elmore delay
    • L.P.P.P. van Ginneken. Buffer placement in distributed re-tree network for minimal elmore delay. In Inrl. Symp. Circuits and Systems, pages 865-868, 1990.
    • (1990) Inrl. Symp. Circuits and Systems , pp. 865-868
    • Van Ginneken, L.P.P.P.1
  • 7
    • 4444343172 scopus 로고    scopus 로고
    • Variational delay metrics for interconnect timing analysis
    • ACM Press
    • Kanak Agarwal, Dennis Sylvester, David Blaauw, Frank Liu, Sani Nassif, and Sarma Vrudhula. Variational delay metrics for interconnect timing analysis. In DAC 2004, pages 381-384. ACM Press, 2004.
    • (2004) DAC 2004 , pp. 381-384
    • Agarwal, K.1    Sylvester, D.2    Blaauw, D.3    Liu, F.4    Nassif, S.5    Vrudhula, S.6
  • 10
    • 0027222295 scopus 로고
    • Closed-form expressions for interconnection delay, coupling, and crosstalk in vlsis
    • T. Sakurai. Closed-form expressions for interconnection delay, coupling, and crosstalk in vlsis. Electron Devices, IEEE Transactions on, 40(1):118-124, 1993.
    • (1993) Electron Devices, IEEE Transactions on , vol.40 , Issue.1 , pp. 118-124
    • Sakurai, T.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.