Impression and compression creep of SiAlON ceramics

Journal of the American Ceramic Society

Volumn 89, Issue 8, 2006, Pages 2555-2563

  Fox, K M ^a,c,d   Hellmann, J R ^a,c   Dickey, E C ^a,c   Green, D J ^a,c   Shelleman, D L ^a,c   Yeckley, R L ^b,c  

^a PENNSYLVANIA STATE UNIVERSITY   (United States)

^b KENNAMETAL INC   (United States)

^c AMERICAN CERAMIC SOCIETY   (United States)

^d SAVANNAH RIVER NATIONAL LABORATORY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPLEX STRESS FIELD; CREEP-RESISTANT MATERIALS; MULTI-GRAIN JUNCTIONS; STRESS EXPONENTS;

CERAMIC MATERIALS; MICROSTRUCTURE; STRESS ANALYSIS; TRANSMISSION ELECTRON MICROSCOPY;

SILICON COMPOUNDS;

EID: 33745931863     PISSN: 00027820     EISSN: 15512916     Source Type: Journal    
DOI: 10.1111/j.1551-2916.2006.01100.x     Document Type: Article

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