Impression creep behavior of SiC particle-MoSi2 composites

Journal of Materials Research

Volumn 11, Issue 6, 1996, Pages 1528-1536

  Butt, Darryl P ^a   Korzekwa, David A ^a   Maloy, Stuart A ^a   Kung, H ^a   Petrovic, John J ^a  

^a LOS ALAMOS NATIONAL LABORATORY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHARACTERIZATION; COMPRESSIVE STRENGTH; COMPUTER SIMULATION; CREEP; FINITE ELEMENT METHOD; GRAIN BOUNDARIES; HIGH TEMPERATURE EFFECTS; MOLYBDENUM COMPOUNDS; PRESSING (FORMING); SILICON CARBIDE; STRAIN RATE; STRESS CONCENTRATION;

EFFECTIVE COMPRESSIVE STRESS; IMPRESSION CREEP BEHAVIOR; MATERIAL STRESS EXPONENT; PINNING GRAIN BOUNDARIES; PUNCH; PUNCH PRESSURE; RATE CONTROLLING MECHANISMS;

CERAMIC MATRIX COMPOSITES;

EID: 0030164709     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/JMR.1996.0191     Document Type: Article

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