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Volumn 249, Issue 1-2 SPEC. ISS., 2006, Pages 310-313
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Stress and stress relief in dielectric thin films - the role of hydrogen
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Author keywords
Crack; ERD; Hydrogen; PECVD; Stress; Thin film
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Indexed keywords
ANNEALING;
CRACKS;
HYDROGEN;
OSCILLATIONS;
PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION;
SILICA;
STRESS RELIEF;
STRESSES;
SUBSTRATES;
TENSILE STRESS;
THERMAL EFFECTS;
THIN FILMS;
ANNEALING TEMPERATURE;
DIELECTRIC THIN FILMS;
ERD;
PECVD;
DIELECTRIC FILMS;
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EID: 33745818576
PISSN: 0168583X
EISSN: None
Source Type: Journal
DOI: 10.1016/j.nimb.2006.04.018 Document Type: Article |
Times cited : (9)
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References (20)
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