Time-independent plastic behaviour of solders and its effect on FEM simulations for electronics packages

2002 Proceedings - 8th International Advanced Packaging Materials Symposium

Volumn , Issue , 2002, Pages 104-111

  Wiese, Steffen ^a   Rzepka, Sven ^a   Meusel, Ekkehard ^a  

^a DRESDEN UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

Constitutive equation; Flip chip; Lead free solder; Reliability

Indexed keywords

CHIP SCALE PACKAGES; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; LEAD-FREE SOLDERS; PACKAGING MATERIALS; RELIABILITY; SOLDERED JOINTS; SOLDERING ALLOYS;

COMPLEX STRESS STATE; FLIP CHIP; FLIP CHIP SOLDER JOINTS; FORCE DISPLACEMENT; PLASTIC BEHAVIOUR; THREE-POINT-BENDING EXPERIMENTS; TIME INDEPENDENTS; TYPICAL APPLICATION;

CONSTITUTIVE EQUATIONS;

EID: 84949948176     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISAPM.2002.990371     Document Type: Conference Paper

References (3)

1. Shetty, S.; Reinikainen, T.: Three and Four-Point Bend Testing for Electronic Packages. In: Proceedings of the 2nd Conference on Benefiting from Thermal and Mechanical Simulation in (Micro-) Electronics EuroSimE 2001, Paris, 9-11 April 2001, Paris, Europia 2001, pp. 203-208
2. Wiese, S.; Feustel. F.; Rzepka, S.; Meusel, E.: Creep and Crack Propagation in Flip Chip SnPb37 Solder Joints. In: Proceedings IEEE 49th Electronic Components and Technology Conference, San Diego, 1-4 June 1999, pp. 1015-1020
3. Wiese, S.; Schubert, A.; Walter, H.; Dudek, R.; Feustel, F.; Meusel, E.; Michel, B.: Constitutive Behaviour of Lead-free Solders vs. Lead-containing Solders-Experiments on Bulk Specimens and Flip-Chip Joints. In: Proceedings IEEE 51th Electronic Components and Technology Conference, Orlando, 29 May-1 June 2001, pp. 890-902