Fabrication of micro-heatsink by nanotemplate synthesis and its cooling characteristics

2005 Spanish Conference on Electron Devices, Proceedings

Volumn 2005, Issue , 2005, Pages 439-442

  Son, Won Il ^a   Hong, Joo Hee ^a   Hong, Jae Min ^a  

^a Korea Institute of Science and Technology   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; COOLING; ELECTROLESS PLATING; NANOTECHNOLOGY; SEMICONDUCTOR MATERIALS; THERMAL CONDUCTIVITY;

ELECTRONIC COMPONENTS; ELECTRONICS SYSTEM; HEAT GENERATION; MICRO-HEATSINK;

HEAT SINKS;

EID: 33745711875     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/SCED.2005.1504476     Document Type: Conference Paper

References (5)

1. E. J. Hahm, W. I. Son, J-M. Hong, "Fabrication of microheatsink using nanotemplate", J. Microelectronics & Packaging Soc. 10(1), pp. 7-11, 2003.
2. H. J. An, W. I. Son, J-H. Hong, J-M. Hong, "Microheatsink fabricated by electroless plating", J. Microelectronics & Packaging Soc. 11(2), pp. 11-16, 2004.
3. L. Xu, et al., "Copper thin coating deposition on natural pollen particles", Appl Surf. Sci., 183(1/2),58-61, 2001.
4. H. H. Hsu, K. H. Lin, S. J. Lin, and J. W. Yeh, "Electroless copper deposition for ultralarge-scale integration", J. Electrochem. Soc., 148(1), C47-C53, 2001.
5. J. F. Rohan, G. O'Riordan, J. Boardman, "Selective electroless nickel deposition on copper as a final barrier/bonding layer material for microelectronics applications", Appl. Surf. Sci., 185(3/4), 289-297, 2002.