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Volumn 6153 I, Issue , 2006, Pages

Resist process window characterization for the 45-nm node using an interferometric immersion microstepper

Author keywords

Bossung; Immersion; Interference; Lithography; Photoresist; Process window

Indexed keywords

COMPUTER SIMULATION; IMAGING TECHNIQUES; INTERFEROMETERS; INTERFEROMETRY; MODULATION; PROCESS CONTROL;

EID: 33745625392     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.657578     Document Type: Conference Paper
Times cited : (1)

References (7)
  • 1
    • 0343007082 scopus 로고    scopus 로고
    • Deep-ultraviolet interferometric lithography as a tool for assessment of chemically amplified photoresist performance
    • W. Hinsberg, F. A. Houle, J. Hoffnagle, M. Sanchez, G. Wallraff, M. Morrison, and S. Frank, "Deep-ultraviolet interferometric lithography as a tool for assessment of chemically amplified photoresist performance", J. Vac. Sci. Technol. B 16(6) 3689
    • J. Vac. Sci. Technol. B , vol.16 , Issue.6 , pp. 3689
    • Hinsberg, W.1    Houle, F.A.2    Hoffnagle, J.3    Sanchez, M.4    Wallraff, G.5    Morrison, M.6    Frank, S.7
  • 4
    • 0141611994 scopus 로고    scopus 로고
    • Characterization of photoresist spatial resolution by interferometric lithography
    • J. A. Hoffnagle, W. D. Hinsberg, F. A. Houle, and M. I. Sanchez, "Characterization of photoresist spatial resolution by interferometric lithography", Proc SPIE 5038 (2003) 464
    • (2003) Proc SPIE , vol.5038 , pp. 464
    • Hoffnagle, J.A.1    Hinsberg, W.D.2    Houle, F.A.3    Sanchez, M.I.4
  • 6
    • 33745610592 scopus 로고    scopus 로고
    • KLA-Tencor, Austin, TX, USA
    • PROLITH v.9.2, KLA-Tencor, Austin, TX, USA
    • PROLITH V.9.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.