Analysis of the effect of mechanical strength of the resist film on pattern collapse behavior using atomic force microscope

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 6153 II, Issue , 2006, Pages

  Tamada, Osamu ^a   Goto, Tomohiro ^a   Sanada, Masakazu ^a   Moriuchi, Takahiro ^b   Niiyama, Takayoshi ^b   Kawai, Akira ^b  

^a DAINIPPON SCREEN MFG CO LTD   (Japan)

^b NAGAOKA UNIVERSITY OF TECHNOLOGY   (Japan)

Author keywords

DPAT; Load; PAB process; Pattern collapse; Tip indentation method

Indexed keywords

ADHESION; ATOMIC FORCE MICROSCOPY; ELLIPSOMETRY; INDENTATION; OPTICAL FILMS; SEMICONDUCTOR DEVICE MANUFACTURE; STRENGTH OF MATERIALS;

DPAT; LOAD; PAB PROCESS; PATTERN COLLAPSE; TIP INDENTATION METHOD;

PHOTORESISTS;

EID: 33745624859     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.651999     Document Type: Conference Paper

References (5)

1. S. Hien, G Rich, G Molina, H. B. Cao and P. F. Nealey, "Collapse behavior of single layer 193 and 157 nm resists: Use of surfactants in the rinse to realize the sub 130 nm nodes", Proc. SPIE, 4690 254 (2002)
2. G Petricich, K. Suzuki, J. Munemasa, T. Yoshikawa, N. Kawakami, S. Shimizu and M. Watanabe, "Supercritical resist dry technique for electron-beam projection lithography", Proc. SPIE, 5037 917 (2003)
3. O. Tamada and M. Sanada, "Improvement of resist process margin with short develop time process", Proc. SPIE, 5039 770 (2003)
4. O. Tamada, M. Sanada, A. Ishikawa, T. Niiyama and A. Kawai, " Mechanical Strength of Resist Film Analyzed by Tip Indentation Method", Proc. SPIE, 5753 1008 (2005)
5. M. Sanada, O. Tamada, A. Ishikawa and A. Kawai, "Analysis for Collapse Behavior of Resist Pattern in Short Develop Time Process Using Atomic Force Microscope", Proc. SPIE, 5753 988 (2005)