Overlay improvement by using new framework of grid compensation for matching

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 6152 II, Issue , 2006, Pages

  Sukegawa, Ayako ^a   Wakamoto, Shinji ^a   Nakajima, Shinichi ^a   Kawakubo, Masaharu ^a   Magome, Nobutaka ^a  

^a NIKON CORPORATION   (Japan)

Author keywords

GCM; Mix Match; Overlay; SDM

Indexed keywords

DATA REDUCTION; DEFORMATION; PARAMETER ESTIMATION; SEMICONDUCTOR DEVICE MANUFACTURE;

GCM; MIX &MATCH; OVERLAY; SDM;

DISTRIBUTED COMPUTER SYSTEMS;

EID: 33745624249     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.656876     Document Type: Conference Paper

References (4)

1. T. Umatate, "Method for Successive Alignment of Chip Patterns on a Substrate," US Patent, 4,780,617, 1988.
2. K. Takahisa, Y. Ishii and N. Tokuda, "Induction of New Techniques for Matching Overlay Enhancement" Prc. SPIE, Vol.4346, pp. 1608-1616, 2001
3. S. Nakajima and S. Watanabe "Simulation Data Generation from Extended EGA Model and Optimization of Alignment Strategy for Lithography", ISITA,2004
4. S. Nakajima, Y. Kanaya, M. Li, T. Sugihara, A. Sukegawa and N. Magome, "Outlier rejection with mixture models in alignment", Prc. SPIE, Vol. 5040, pp. 1729-1741, 2003