Scanning thermal microscopy evaluation of interface thermal property of composites for electronic packaging

Journal of Trace and Microprobe Techniques

Volumn 19, Issue 3, 2001, Pages 365-373

  Ji, Yuan ^a,b   Zhong, Taoxing ^a,b   Gao, Xiaoxia ^a,b   Luo, Dong ^a,b   Li, Huier ^a,b   Chen, Haoming ^a,b   Wang, Xiufeng ^a,b   Han, Li ^a,b  

^a BEIJING UNIVERSITY OF TECHNOLOGY   (China)

^b TSINGHUA UNIVERSITY   (China)

Author keywords

Composite; Interface thermal conductivity; Scanning thermal microscope

Indexed keywords

EID: 33745570924     PISSN: 07334680     EISSN: None     Source Type: Journal    
DOI: 10.1081/TMA-100105052     Document Type: Article

References (5)

1. Young, R.; Moses, A. Design Guidelines for Advanced Silicon-Carbide Aluminum Composite Materials. 43rd International SAMPE Symposium. 1998, 540-551.
2. Ji, Y.; Zhong, T.X.; Li, Y.; Li, H.E.; Gao, X.X. Study on SiCp/Cu Composites for Electronic Packaging. The 3rd International Symposium on Electronic Packaging Technology. 1988, 158-161.
3. Majumdar, A.; Luo, K.; Lai, J.; Shi, Z. Failure Analysis of Sub-Micrometer Devices and Structures Using Scanning Thermal Microscopy. IEEE. 1996, 342-345.
4. Majumdar, A.; Luo, K.; Shi, Z.; Varesi, J. Scanning Thermal Microscopy at Nanometer Scales: A New Frontier in Experimental Heat Transfer. Experimental Heat Transfer. 1996 (9), 83-103.
5. Thermal imaging. Digital instruments, Support Note No. 235. Rev. A. 1996, 1-3.