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Volumn 43, Issue 1, 1998, Pages 540-552
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Design guidelines for advanced silicon-carbide aluminum composite materials
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Author keywords
[No Author keywords available]
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Indexed keywords
ALUMINUM;
DENSITY (SPECIFIC GRAVITY);
ELECTRONICS PACKAGING;
METALLIC MATRIX COMPOSITES;
SILICON CARBIDE;
THERMAL CONDUCTIVITY OF SOLIDS;
THERMAL EXPANSION;
SILICON CARBIDE ALUMINUM COMPOSITES;
THERMAL MANAGEMENT;
THERMAL INSULATING MATERIALS;
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EID: 0031627874
PISSN: 08910138
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
Times cited : (2)
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References (6)
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