Electrical resistance modeling of isotropically conductive adhesive joints

28th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2005

Volumn 2005, Issue , 2005, Pages 144-149

  Mundlein M ^a   Nicolics, J ^a  

^a VIENNA UNIVERSITY OF TECHNOLOGY   (Austria)

Author keywords

[No Author keywords available]

Indexed keywords

COMPOSITE MATERIALS; ELECTRIC CONDUCTORS; ELECTRIC PROPERTIES; ELECTRIC RESISTANCE; FILLERS; INTERCONNECTION NETWORKS;

ELECTRICAL CONTACT BEHAVIOR; ISOTROPICALLY CONDUCTIVE ADHESIVE (ICA); MECHANICAL FORCES; POLYMER BINDER;

ADHESIVE JOINTS;

EID: 33745463706     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISSE.2005.1491016     Document Type: Conference Paper

References (12)

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