Modeling of particle arrangement in an isotropically conductive adhesive joint

2004 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics

Volumn , Issue , 2004, Pages 251-256

  Mündlein, Martin ^a   Nicolics, Johann ^a  

^a VIENNA UNIVERSITY OF TECHNOLOGY   (Austria)

Author keywords

[No Author keywords available]

Indexed keywords

BINDERS; COMPOSITE MATERIALS; COMPUTER SIMULATION; ELECTRIC CONTACTS; ELECTRIC RESISTANCE; FILLERS; MATHEMATICAL MODELS; PERCOLATION (SOLID STATE); PROBABILITY; SOLDERING;

ELECTRIC CONTACT BEHAVIOR; FILLER PARTICLES; ISOTROPICALLY CONDUCTIVE ADHESIVES (ICA); PARTICLE ARRANGEMENTS;

ADHESIVE JOINTS;

EID: 17044386964     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

1. th International Spring Seminar on Electronics Technology (ISSE 2002), Prague, Czech Republic; May 11-14 2002; ISBN 0-7803-9824-6, pp.329-333.
2. Mündlein, M., Nicolics, J., Hanreich, G.: "Accelerated Curing of Isotropically Conductive Adhesives by Vapor Phase Heating"; Third International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics (Polytronic 2003), Montreaux, Switzerland, October 21-23 2003, pp.101-105.
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