Properties and utilization of 3D bent-multilayer hybrid structures

Proceedings of the International Spring Seminar on Electronics Technology

Volumn 2, Issue , 2004, Pages 291-295

  Slosarčík, Stanislav ^a   Pietriková, Alena ^a   Urbančík, Ján ^a   Kalita, Wlodzimierz ^b   Bauer, Reinhard ^c  

^a TECHNICAL UNIVERSITY OF KO ICE   (Slovakia)

^b RZESZOW UNIVERSITY OF TECHNOLOGY   (Poland)

^c UNIVERSITY OF APPLIED SCIENCES DRESDEN   (Germany)

Author keywords

3D multilayer hybrid structures; LTCC

Indexed keywords

COMPUTER AIDED ANALYSIS; INTEGRATED CIRCUIT INTERCONNECTS; MICROPROCESSOR CHIPS;

EXPERIMENTAL ANALYSIS; INTERCONNECTION RESISTANCE; LTCC; MULTI-LAYER HYBRIDS; MULTILAYER STRUCTURES; NON-DESTRUCTIVE MEASUREMENT; PRODUCTION TECHNOLOGY; THREE-DIMENSIONAL APPLICATIONS;

MULTILAYERS;

EID: 33745479342     PISSN: 21612528     EISSN: 21612536     Source Type: Conference Proceeding    
DOI: 10.1109/ISSE.2004.1490437     Document Type: Conference Paper

References (4)

1. BAUER, R. - WOLTER, J. - SAUER, W.: Three- dimen-sionally formed thick film devices with LTCC Multilayer Technology, Proceedings, IMAPS, Los Angeles, USA
2. PIETRIKOVA, A. - SLOSARCiK, S.: Mechanical properties of bent modules based on LTCC ceramics, Iranian Journal of Electrical and Computer Engineering, Vol.1, No. 1, 2002, pp.47-50
3. PIETRIKOVA, A. - SLOSARCIK, S. - SALIGA, J. -BANSKY, J. - KOKULA, R.: Influence of bent multilayer LTCC modules on some electrical parameters, 25th International Spring Seminar on Electronics Technology, Proceedings, Praha, 2002, pp.224-228
4. HOTRA, Z. - KALITA, W. - PIETRIKOVA, A. -SLOSARCIK, S.: Best Laminated Modules Based on LTCC, Technicne listi, 2002/1,2,1!vov, Ukraine, pp.51-55