Warp of silicon wafers produced from wiresaw slicing: Modeling, simulation, and experiments

ECS Transactions

Volumn 2, Issue 2, 2006, Pages 123-134

  Gupta, Puneet ^a   Kulkarni, Milind S ^a  

^a MEMC Electronic Materials Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; FINITE ELEMENT METHOD; INGOTS; MATHEMATICAL MODELS; SLURRIES; THERMAL EXPANSION;

DIFFERENTIAL THERMAL EXPANSION; STRUCTURAL FINITE ELEMENT BASED APPROACH; WIRESAW PROCESS;

WSI CIRCUITS;

EID: 33745444975     PISSN: 19385862     EISSN: 19386737     Source Type: Conference Proceeding    
DOI: 10.1149/1.2195654     Document Type: Conference Paper

References (8)

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2. "Development of Fixed-Abrasive-Grain Wire Saw with Less Cutting Loss", J. Sugawara, H. Hara and A. Mizoguchi, SEI Technical Review, 58, 7 (2004)
3. "Free Abrasive Machining in Slicing Brittle Materials with Wiresaw", F. Yang and I. Kao, J. Electronic Packaging, 123, 254 (2001)
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6. "Free convection around immersed bodies", S. W. Churchill, in Heat Exchanger Design Handbook 2, C. F. Beaton, D. Butterworth, M. Morris and J. Taborek, Editors, Ch. 2.5.7, Begel House, New York (2002)
7. E. N. Sieder and G. E. Tate, Ind. Eng. Chem., 28, 1429 (1936)
8. R. D. Cook, D. S. Malkus, M. E. Plesha and R. J. Witt, Concepts and Applications of Finite Element Analysis, Ch. 3, John Wiley & Sons, Inc., New York (2002)