Simulation of pin-reinforced single-lap composite joints

Composites Science and Technology

Volumn 66, Issue 11-12, 2006, Pages 1623-1638

  Grassi, M ^a   Cox, B ^b   Zhang, X ^c  

^a QINETIQ   (United Kingdom)

^b ROCKWELL SCIENTIFIC COMPANY   (United States)

^c CRANFIELD UNIVERSITY   (United Kingdom)

Author keywords

Adhesively bonded lap joint; Bridging law; Debond; Delamination; Pipes; Through thickness reinforcement

Indexed keywords

COMPUTER SIMULATION; CRACKS; DEBONDING; DEFORMATION; DELAMINATION; FRACTURE; MATHEMATICAL MODELS; PIPE; PLASTIC LAMINATES; STRENGTH OF MATERIALS;

ADHESIVELY BONDED LAP JOINT; DEBOND RESISTANCE; PIN-REINFORCED SINGLE-LAP COMPOSITE JOINTS; THROUGH-THICKNESS REINFORCEMENT;

ADHESIVE JOINTS;

CALCULATION; COMPOSITE; DEBONDING; FRACTURE; SIMULATION; STRENGTH;

EID: 33745092845     PISSN: 02663538     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.compscitech.2005.11.013     Document Type: Article

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