A new fabrication method for low stress PECVD - SiNx layers

Journal of Physics: Conference Series

Volumn 34, Issue 1, 2006, Pages 764-769

  Ong, Poh Lam ^a,b   Wei, Jiashen ^b   Tay, Francis E H ^a,b   Iliescu, Ciprian ^a,b  

^a INSTITUTE OF BIOENGINEERING AND NANOTECHNOLOGY   (Singapore)

^b NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 33744550463     PISSN: 17426588     EISSN: 17426596     Source Type: Conference Proceeding    
DOI: 10.1088/1742-6596/34/1/126     Document Type: Article

References (10)

1. Lin H, Xu L Q, Chen X, Wang X H, Sheng M, Stubhan F, Merkel K H and Wilde J 1998 Thin Solid Films 333 71
2. Wuu D S, Lo W C, Chiang C C, Lin H B, Chang L S, Horng R H, Huang C L and Gao Y J 2005 Surf. Coat. Technol. 198 114
3. Yota J, Janani M, Camilletti L E, Kar-Roy A, Liu Q Z, Nguyen C and Woo M D 2000 IEEE p 76
4. Huang H, Winchester K, Liu Y, Hu X Z, Musca C A, Dell J M and Faraone L 2005 J. Micromech. Microeng. 15 608
5. Tarraf A, Daleiden J, Irmer S, Prasai D, Hillmer H 2004 J. Micromech. Microeng. 14 317
6. van de Ven E P, Connick I W, Harrus A S 1990 Proc. VLSI Multilevel Interconnection Conf. (VMIC) 94
7. Loboda M J, Seifferly J A 1996 J. Mater. Res. 11 391
8. Machenzie K D, Reelfs B, Devre M W, Westerman R, Johnson D J 2004 Chip vol 10 p 26
9. Smith D L, Alimonda A S and von Preissig F J 1990 J. Vacuum Sci. Technol. B 8 551
10. Hess D W 1984 J. Vacuum Sci. Technol. A 2 244