Electrocoagulation of silica nanoparticles in wafer polishing wastewater by a multichannel flow reactor: A kinetic study

Journal of Environmental Engineering

Volumn 132, Issue 12, 2006, Pages 1651-1658

  Den, Walter ^a   Huang, Chihpin ^b  

^a TUNGHAI UNIVERSITY   (Taiwan)

^b NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

Author keywords

Channel flow; Coagulation; Colloids; Kinetics; Laminar flow; Silica; Wastewater management; Water treatment

Indexed keywords

CHEMICAL MECHANICAL POLISHING; CHEMICAL REACTORS; CHEMICALS REMOVAL (WATER TREATMENT); COAGULATION; CURRENT DENSITY; NANOSTRUCTURED MATERIALS; PH EFFECTS; SILICA;

ELECTROCOAGULATION; HYDRAULIC RETENTION TIME; MULTICHANNEL FLOW REACTOR; WAFER POLISHING WASTEWATER;

WASTEWATER TREATMENT;

CHEMICAL MECHANICAL POLISHING; CHEMICAL REACTORS; CHEMICALS REMOVAL (WATER TREATMENT); COAGULATION; CURRENT DENSITY; NANOSTRUCTURED MATERIALS; PH EFFECTS; SILICA; WASTEWATER TREATMENT;

BIOREACTOR; CHANNEL FLOW; COAGULATION; COLLOID; EXPERIMENTAL STUDY; LABORATORY METHOD; LAMINAR FLOW; SILICA; WASTE MANAGEMENT; WASTE TREATMENT; WASTEWATER;

EID: 33744539186     PISSN: 07339372     EISSN: None     Source Type: Journal    
DOI: 10.1061/(ASCE)0733-9372(2006)132:12(1651)     Document Type: Article

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