The reliability issues on ASIC/memory integration by SiP (system-in-package) technology

Proceedings - IEEE International SOC Conference, SOCC 2003

Volumn , Issue , 2003, Pages 7-10

  Song, Yong Ha ^a   Kim, Soon Gon ^a   Rhee, Kwang Joon ^a   Cho, Dong Soo ^a   Kim, Taek Soo ^a  

^a SAMSUNG Electronics   (South Korea)

Author keywords

Application specific integrated circuits; Bonding; Earth Observing System; Energy consumption; Integrated circuit reliability; Large scale integration; Leakage current; Packaging; Routing; SDRAM

Indexed keywords

APPLICATION SPECIFIC INTEGRATED CIRCUITS; BONDING; ELECTROMAGNETIC PULSE; ENERGY UTILIZATION; INTEGRATED CIRCUITS; LEAKAGE CURRENTS; LSI CIRCUITS; PACKAGING; PRINTED CIRCUIT BOARDS; PRINTED CIRCUITS; PROGRAMMABLE LOGIC CONTROLLERS; RELIABILITY;

EARTH OBSERVING SYSTEMS; ELECTRICAL OVERSTRESS; INTEGRATED CIRCUIT RELIABILITY; LATCH-UPS; ONE CHIP; ROUTING; SDRAM; SIZE REDUCTIONS;

SYSTEM-IN-PACKAGE;

EID: 33744511660     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/SOC.2003.1241451     Document Type: Conference Paper

References (6)

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