Precipitation in Cu-Ni-Si-Zn alloy for lead frame

Materials Letters

Volumn 57, Issue 13-14, 2003, Pages 2135-2139

  Huang, Fuxiang ^a   Ma, Jusheng ^a   Ning, Honglong ^a   Cao, YuWen ^a   Geng, Zhiting ^a  

^a TSINGHUA UNIVERSITY   (China)

Author keywords

Age hardening; Copper alloy; Precipitation

Indexed keywords

AGE HARDENING; COLD ROLLING; COPPER ALLOYS; ELECTRIC CONDUCTIVITY; LEAD COMPOUNDS;

LEAD FRAMES;

TERNARY SYSTEMS;

EID: 0037378271     PISSN: 0167577X     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0167-577X(02)01212-0     Document Type: Article

References (11)

1. Corson M.G. Trans. AIME. 1927;435.
2. Corson M.G. Iron Age. 119:1927;421.
3. Okamoto M. Trans. Inst. Met. 3(9):1939 (Jan);336.
4. Robertson W.D.et al. Trans. Metall. Soc. AIME. 221:1961;503.
5. Kim Y.G., Ryu C. Semicond. Int. 8:1985;250.
6. Kim Y.G.et al. J. Mater. Sci. 21(4):1986;1357-1362.
7. Rdzawski Z.et al. Mater. Sci. Technol. 9:1993;142-149.
8. Lockyer S.A., Noble F.W. J. Mater. Sci. 29:1994;218-226.
9. Fujiwara, Hidemichiet al. J. Jpn. Inst. Met. 62:1998;301-309.
10. Ghosh G., Miyake J., Fine M.E. JOM. 49:1997;56-60.
11. Miyake J., Ghosh G., Fine M.E. MRS Bull. 21:1996;13-18.