Investigation of improved adhesion between Cu film and polyimide by the PSII-EIAMAD technique

Surface and Interface Analysis

Volumn 38, Issue 4, 2006, Pages 343-347

  Lee, Yeonhee ^a   Hong, Ju Hi ^a   Chun, Hyejin ^a   Han, Seunghee ^a  

^a Korea Institute of Science and Technology   (South Korea)

Author keywords

Adhesion; AES; Deposition; Plasma source ion implantation; Polyimide

Indexed keywords

ADHESION; COPPER COMPOUNDS; ION BOMBARDMENT; ION IMPLANTATION; PLASMA SOURCES; SURFACE TREATMENT;

ADHESION STRENGTH; HIGH-VOLTAGE PULSES; PLASMA SOURCE ION IMPLANTATION; PLASMA SOURCE ION IMPLANTATION (PSII);

THIN FILMS;

EID: 33646594754     PISSN: 01422421     EISSN: 10969918     Source Type: Journal    
DOI: 10.1002/sia.2230     Document Type: Conference Paper

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