Analysis of critical dimension uniformity for step and flash imprint lithography

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 5037 I, Issue , 2003, Pages 187-196

  Mancini, David P ^a   Gehoski, Kathleen A ^a   Dauksher, William J ^a   Nordquist, Kevin J ^a   Resnick, Douglas J ^a   Schumaker, Philip ^b   McMackin, Ian ^b  

^a MOTOROLA INC   (United States)

^b MOLECULAR IMPRINTS INC   (United States)

Author keywords

Across chip linewidth variation (ACLV); SFIL; Step and flash imprint lithography; Template; Uniformity

Indexed keywords

CALCULATIONS; CHARACTERIZATION; IMAGE QUALITY; MICROELECTRONICS; NANOTECHNOLOGY; SILICON WAFERS; THICKNESS CONTROL;

ACROSS CHIP LINEWIDTH VARIATION; STEP AND FLASH IMPRINT LITHOGRAPHY; TEMPLATE; UNIFORMITY;

LITHOGRAPHY;

EID: 0141613085     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.484923     Document Type: Conference Paper

References (6)

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2. D. J. Resnick, W. J. Dauksher, D. Mancini, K. J. Nordquist, E. Ainley, K. Gehoski, J. H. Baker, T. C. Bailey, B. J. Choi, S. Johnson, S. V. Sreenivasan, J. G. Ekerdt, C. G. Willson, "High resolution templates for step and flash imprint lithography", Proc. of SPIE, vol. 4688, pp. 205-213, 2002.
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5. B. J. Choi, S. Johnson, M. Colburn, S.V. Sreenivasan, C. G. Willson; "Design of orientation stages for step and flash imprint lithography", J. Precision Engineering, vol. 25, no. 3, July 2001.
6. M. Colburn, S. Johnson, M. Stewart, S. Damle, B. J. Choi, T. Bailey, M. Wedlake, T. Michaelson, S.V. Sreenivasan, J. Ekerdt, C.G. Willson; "Step and flash imprint lithography: An alternative approach to high Resolution patterning.", Proc. of SPIE, vol. 3676, pp. 379-389 (1999).