Minimization of residual layer thickness by using the optimized dispensing method in S-FILTM process

Microelectronic Engineering

Volumn 83, Issue 4-9 SPEC. ISS., 2006, Pages 847-850

  Kim, Ki don ^a   Jeong, Jun ho ^a   Sim, Young suk ^a   Lee, Eung sug ^a  

^a Korea Institute of Machine and Materials   (South Korea)

Author keywords

Dispensing method; Residual layer thickness; S FIL process; UV nanoimprint lithography

Indexed keywords

ETCHING; ITERATIVE METHODS; LITHOGRAPHY; NUMERICAL ANALYSIS; OPTIMIZATION; RESINS; SUBSTRATES; ULTRAVIOLET RADIATION;

DISPENSING METHOD; RESIDUAL LAYER THICKNESS; S-FIL PROCESS; UV NANOIMPRINT LITHOGRAPHY;

THICKNESS CONTROL;

EID: 33646480795     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2006.01.037     Document Type: Article

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